R20UT3708EJ0100-AUTOSARs



AUTOSAR MCAL R4.0.3
User’s Manual
DIO Driver Component Ver.1.0.9
Embedded User’s Manual
Target Device:
RH850/P1x
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
www.renesas.com
Rev 1.00 Oct 2016
2
Notice
1.
All information included in this document is current as of the date this document is issued. Such information, however, is subject to change
without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information
with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by
Renesas Electronics such as that disclosed through our website.
2.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by
or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or
otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
3.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor
products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of
your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these
circuits, software, or information.
5.
When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations
and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described
in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons
of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose
manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations.
6.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant
that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors
in or omissions from the information included herein.
7.
Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The
recommended applications for each Renesas Electronics product depends on the product's quality grade, as indicated below. You must check
the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics
product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any
Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas
Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics
product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a
Renesas Electronics data sheets or data books, etc.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home
electronic appliances; machine tools; personal electronic equipment; and industrial robots.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti- crime systems;
safety equipment; and medical equipment not specifically designed for life support.
"Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support
(e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications
or purposes that pose a direct threat to human life.
8.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with
respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and
other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics
products beyond such specified ranges.
9.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics
products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of
physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer
software alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
10.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas
Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion
or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or
losses occurring as a result of your noncompliance with applicable laws and regulations.
11.
This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12.
Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority- owned
subsidiaries.
(Note 2) “Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
3
4
Abbreviations and Acronyms
Abbreviation / Acronym Description
ADC
Analog Digital Converter
ANSI
American National Standards Institute
API
Application Programming Interface
AUTOSAR
AUTomotive Open System ARchitecture
CAN
Controller Area Network
DEM
Diagnostic Event Manager
DET/Det
Development Error Tracer
DIO
Digital Input Output
ECU
Electronic Control Unit
EEPROM
Electrical Erasable Programmable Read Only Memory
Id
Identifier
I/O
Input/Output
LIN
Local Interconnect Network
MCAL
MicroController Abstraction Layer
MCU
MicroController Unit
PWM
Pulse Width Modulation
RAM
Random Access Memory
ROM
Read Only Memory
RTE
Run Time Environment
RUCG
Renesas Unified Code Generator
SCI
Serial Communication Interface
SPI
Serial Peripheral Interface
WDT
WatchDog Timer
Definitions
Term
Represented by
Port
Represents a whole configurable port on a microcontroller device.
Port Pin
Represents a single configurable input or output pin on a
microcontroller device.
Sl. No.
Serial Number
5
6
Table of Contents
Chapter 1 Introduction ..................................................................... 11
1.1.
Document Overview ........................................................................................................... 13
Chapter 2 Reference Documents..................................................... 15
Chapter 3 Integration and Build Process ........................................ 17
3.1.
DIO Driver Component Makefile ........................................................................................ 17
3.1.1.
Folder Structure.................................................................................................... 17
Chapter 4 Forethoughts ................................................................... 19
4.1.
General ................................................................................................................................. 19
4.2.
Preconditions ...................................................................................................................... 19
4.3.
Data Consistency ................................................................................................................ 20
4.4.
Deviation List ...................................................................................................................... 21
4.5.
User mode and supervisor mode ...................................................................................... 21
Chapter 5 Architecture Details ......................................................... 23
Chapter 6 Register Details ............................................................... 27
Chapter 7 Interaction between the User and DIO Driver
Component .......................................................................................... 29
7.1. Services Provided By DIO Driver Component To The ........................................................... 29
Chapter 8 DIO Driver Component Header and Source File
Description .......................................................................................... 31
Chapter 9 Generation Tool Guide .................................................... 33
Chapter 10 Application Programming Interface ............................... 35
10.1.
Imported Types ................................................................................................................... 35
10.1.1.
Standard Types .................................................................................................... 35
10.1.2.
Other Module Types ............................................................................................. 35
10.2.
Type Defintions ................................................................................................................... 35
10.2.1.
Dio_ChannelType ................................................................................................ 35
10.2.2.
Dio_PortType ....................................................................................................... 36
10.2.3.
Dio_PortLevelType ............................................................................................... 36
10.2.4.
Dio_ConfigType ................................................................................................... 36
10.3.
Function Definitions ........................................................................................................... 37
Chapter 11 Development and Production Errors ............................. 39
11.1.
DIO Driver Component Development Errors ................................................................... 39
11.2.
Dio Driver Component Production Errors ........................................................................ 40
Chapter 12 Memory Organization ...................................................... 41
Chapter 13 P1M Specific Information ................................................ 43
13.1.
Interaction between the User and DIO Driver .................................................................. 43
13.1.1.
Translation Header File ........................................................................................ 43
7
13.1.2.
Parameter Definition File ...................................................................................... 43
13.2.
Sample Application............................................................................................................. 44
13.2.1
Sample Application Structure ............................................................................... 44
13.2.2
Building Sample Application ................................................................................. 46
13.2.2.1
Configuration Example ..................................................................... 46
13.2.2.2
Debugging the Sample Application .................................................. 46
13.3.
Memory and Throughput ................................................................................................... 47
13.3.1.
ROM/RAM Usage ................................................................................................ 47
13.3.2.
Stack Depth .......................................................................................................... 48
13.3.3.
Throughput Details ............................................................................................... 48
Chapter 14 Release Details ................................................................ 51
8
List of Figures
Figure 1-1
System Overview of AUTOSAR Architecture ...................................................... 11
Figure 1-2
System Overview of the DIO Driver in AUTOSAR MCAL Layer .......................... 12
Figure 5-1
DIO Driver Architecture ........................................................................................ 23
Figure 5-2
DIO Driver Services ............................................................................................. 24
Figure 12-1
DIO Driver Component Memory Organization ..................................................... 41
Figure 13-1 Overview of DIO Driver Sample Application ........................................................ 44
List of Tables
Table 4-1
DIO Driver protected Resources List ................................................................... 20
Table 4-2
Driver Deviation List of DIO module ..................................................................... 21
Table 4-3
User mode and Supervisor mode details ............................................................. 21
Table 6-1
Register Details .................................................................................................... 27
Table 8-1
Description of the DIO Driver Component Files ................................................... 32
Table10-1
DIO Driver Component’s API list. ......................................................................... 37
Table13-1
PDF information for P1M ...................................................................................... 44
Table13-2
ROM/RAM Details with DET ................................................................................ 48
Table13-3
ROM/RAM Details without DET ........................................................................... 48
Table13-4
Throughput Details of the APIs ............................................................................ 49
9
10
Introduction Chapter 1
Chapter 1 Introduction
The purpose of this document is to describe the information related to DIO
Driver Component for Renesas P1x microcontrollers.
This document shall be used as reference by the users of DIO Driver
Component. The system overview of complete AUTOSAR architecture is
shown in the below Figure:
Application Layer
AUTOSAR RTE
System Services
On board Device Abstraction
DI O Drive r
Microcontroller
Figure 1-1
System Overview of AUTOSAR Architecture
The DIO Driver is part of the MCAL, the lowest layer of Basic Software in the
AUTOSAR environment.
11
Chapter 1 Introduction
The Figure in the following page depicts the DIO Driver as part of layered
AUTOSAR MCAL Layer:
Micro control ler Drivers
Memory Dri vers
Communication Drivers
I/O Drivers
in
e
in
t
x
e
W
t
t
rn
er
e
S
a
GP
M
r
a
P
F
t
PO
c
C
C
R
n
n
l
I
H
C
l
P
a
a
A
D
E
L
e
I
hd
C
W
T
U
ore
A
l
l
E
an
I
AN
x
D
I
N
O
R
U
R
M
C
D
o
M
F
F
D
l
la
P
d
D
a
R
D
D
T
g
ri
l
D
y
D
ri
T
T
as
s
e
D
v
D
r
OM
i
r
r
D
v
e
e
h
h
r
v
r
D
i
r
i
i
v
r
er
i
v
ri
r
er
s
st
D
er
v
i
v
e
r
er
v
er
i
t
er
v
v
D
D
r
i
er
i
r
v
er
e
ri
r
i
D
v
r
v
v
e
e
er
er
r
ri
r
v
er
E
Po
EEP
D
Micro-
x
F
W
C
L
P
G
M
t
L
C
C
Unit
lo
w
.
SPI
S
A
I
I
O
A
M
N
W
P
D
C
B
C
AN
CU
D
c
e
Controller
S
R
T
T
k
r
U
U
I
o
M
C
H
O
&
r
S
Figure 1-2 System Overview of the DIO Driver in AUTOSAR MCAL Layer
The DIO Driver Component provides the service for reading and writing to
Channels, ChannelGroups and Ports.
The DIO Driver Component comprises of two sections, that is, Embedded
Software and the Configuration Tool to achieve scalability and configurability.
The DIO Driver Component Code Generation Tool is a command line tool that
accepts ECU configuration description file(s) as input and generates source
and header file(s) Dio_PBcfg.c and Dio_Cfg.h respectively. The ECU
configuration description is an XML file that contains information about the
configuration for Port Pins.
12
Introduction Chapter 1
1.1.
Document Overview
The document has been segmented for easy reference. The table below
provides the user with an overview of the contents of each section:
Section
Contents
Section 1 (Introduction)
This section provides an introduction and overview of DIO Driver
Component.
Section 2 (Reference Documents) This section lists the documents referred for developing this document.
Section 3 (Integration And Build
This section explains the folder structure, Makefile structure for DIO
Process)
Driver Component. This section also explains about the Makefile
descriptions, Integration of DIO Driver Component with other
components, building the DIO Driver Component along with a sample
application.
Section 4 (Forethoughts)
This section provides brief information about the DIO Driver Component,
the preconditions that should be known to the user before it is used, data
consistency details and deviation list.
Section 5 (Architecture Details)
This section describes the layered architectural details of the DIO Driver
Component.
Section 6 (Register Details)
This section describes the register details of DIO Driver Component.
Section 7 (Interaction Between
This section describes interaction of the DIO Driver Component with the
User And DIO Driver Component) upper layers.
Section 8 (DIO Driver Component This section provides information about the DIO Driver Component
Header And Source File
source files. This section also contains the brief note on the tool
Description)
generated output file.
Section 9 (Generation Tool Guide) This section provides information on the DIO Driver Component
Generation Tool.
Section 10 (Application
This section explains all the APIs provided by the DIO Driver
Programming Interface)
Component.
Section 11 (Development And
This section lists the DET and DEM errors.
Production Errors)
Section 12 (Memory
This section provides the typical memory organization, which must be
Organization)
met for proper functioning of component.
Section 13 (P1M Specific
This section provides the P1M Specific Information.
Information)
Section 14 (Release Details)
This section provides release details with version name and base
version.
13
Chapter 1 Introduction
14
Reference Documents
Chapter 2
Chapter 2 Reference Documents
Sl. No.
Title
Version
1.
AUTOSAR_SWS_DIODriver.pdf
2.5.0
2.
r01uh0436ej111_rh850p1x.pdf
1.11
3.
AUTOSAR_SWS_CompilerAbstraction.pdf
3.2.0
4.
AUTOSAR_SWS_MemoryMapping.pdf
1.4.0
5.
AUTOSAR_SWS_PlatformTypes.pdf
2.5.0
6.
AUTOSAR_BSW_MakefileInterface.pdf
0.3
7.
AUTOSAR BUGZILLA (http://www.autosar.org/bugzilla)
-
Note: AUTOSAR BUGZILLA is a database, which contains concerns raised
against information present in AUTOSAR Specifications.
15
Chapter 2 Reference Documents
16
Integration and Build Process
Chapter 3
Chapter 3 Integration and Build Process
In this section the folder structure of the DIO Driver Component is explained.
Description of the makefiles along with samples is provided in this section.
Remark The details about the C Source and Header files that are generated by the
DIO Driver Generation Tool are mentioned in the “R20UT3709EJ0100-
AUTOSAR.pdf”.
3.1.
DIO Driver Component Makefile
The Makefile provided with the DIO Driver Component consists of the GNU
Make compatible script to build the DIO Driver Component in case of any
change in the configuration. This can be used in the upper level Makefile (of
the application) to link and build the final application executable.
3.1.1. Folder Structure
The files are organized in the following folders:
Remark Trailing slash ‘\’ at the end indicates a folder
X1X\common_platform\modules\dio\src\Dio.c
\Dio_Version.c
\Dio_Ram.c
X1X\common_platform\modules\dio\include\Dio.h
\Dio_Debug.h
\Dio_PBTypes.h
\Dio_Ram.h
\Dio_RegWrite.h
\Dio_Version.h
X1X\P1x\modules\dio\sample_application\<SubVariant>\make\ghs
\App_DIO_P1M_Sample.mak
X1X\P1x\modules\dio\sample_application\ <SubVariant>
\obj\<Compiler>
X1X\P1x\modules\dio\generator
\R403_DIO_P1x_BSWMDT.arxml
X1X\common_platform\modules\dio\generator\Dio_X1x.dll
tools\RUCG\RUCG.exe
X1X\P1x\common_family\generator\P1x_translation.h
\Sample_Applications_P1x.trxml
\Global_Application_P1x.trxml
X1X\P1x\modules\dio\user_manual
17
Chapter 3 Integration and Build Process
(User manuals will be available in this folder).
Note: 1. <AUTOSAR_version> should be 4.0.3
2. <SubVariant> can be P1M
3. <Device_name> can be 701304, 701305, 701310,
701311, 701312, 701313, 701314, 701315, 701318,
701319, 701320, 701321, 701322 and 701323.
4. <Compiler> can be ghs
18
Forethoughts Chapter 4
Chapter 4 Forethoughts
4.1.
General
Following information will aid the user to use the DIO Driver Component
software efficiently.
• The DIO Driver does not enable or disable the ECU or Microcontroller
power supply. The upper layer should handle this operation.
• Start-up code is not implemented by the DIO Driver.
• DIO Driver does not implement any callback notification functions.
• DIO Driver does not implement any scheduled functions.
• DIO Driver supports the Readback feature.
• The DIO Driver Component is Postbuild time configurable for R4.0.3.
• The file Interrupt_VectorTable.c provided is just a Demo and not all
interrupts will be mapped in this file. So the user has to update the
Interrupt_VectorTable.c as per his configuration.
• To access the Hardware Registers, The MCAL user should use the Low
Level driver Layer. The MCAL user does not write or read any data directly
from any register, but uses the AUTOSAR standard APIs provided by the
MCAL Layer.
• When the channel is configured as Output, then the PPR register will
reflect the Hardware pin level only when the Port Bi-Direction Control
Register(PBDC) is enabled. Or else only the Port register value will be
updated in the PPR register for the Output configured channels.
4.2.
Preconditions
Following preconditions have to be adhered by the user, for proper
functioning of the DIO Driver Component:
• The Dio_Cfg.h and Dio_PBcfg.c files generated by the DIO Driver
Component Code Generation Tool have to be linked along with DIO
Driver Component source files.
• File Dio_PBcfg.c generated by DIO Driver Component
Generation Tool can be compiled and linked independently.
• The application has to be rebuilt, if there is any change in the Dio_Cfg.h
and Dio_PBcfg.c file generated by the DIO Driver Component Generation
Tool.
• Dio_Ram.c and Dio_Ram.h are used only for Autosar release 4.0.3.
• The DIO Driver Component needs to be initialized before accepting any API
requests. Dio_Init should be called to initialize DIO Driver Component.
• The authorization of the user for calling the software triggering of a
hardware reset is not checked in the DIO Driver. This will be the
responsibility of the upper layer.
• The user should ensure that DIO Driver Component API requests
are invoked with correct input arguments.
19
Chapter 4 Forethoughts
• Input parameters are validated only when the static configuration
parameter DioDevErrorDetect is enabled. Application should ensure that
the right parameters are passed while invoking the APIs when
DioDevErrorDetect is disabled.
• A mismatch in the version numbers of header and the source files will
result in a compilation error. User should ensure that the correct versions
of the header and the source files are used.
• User/Integrator should ensure that same Ports/Pins are configured for
DIO Driver component.
•
The DIO functions shall be called only after PORT Driver
initialization, otherwise DIO functions will exhibit undefined
behavior.
•
Safety features related to write verification only available if
‘DioWriteVerify’ enabled.
4.3.
Data Consistency
To support the re-entrance services, the AUTOSAR DIO module will ensure the
data consistency while accessing its own RAM storage or hardware registers.
The DIO module will use SchM_Enter_Dio_<Exclusive Area> and
SchM_Exit_Dio_<Exclusive
Area>
functions.
The
SchM_Enter_Dio_<Exclusive Area> function is called before the data needs to
be protected and SchM_Exit_Dio_<Exclusive Area> function is called after the
data is accessed.
The following exclusive area along with scheduler services is used to provide
data integrity for shared resource:
• DIO_REGISTER_PROTECTION
The
functions
SchM_Enter_Dio_<Exclusive
Area>
and
SchM_Exit_Dio_<Exclusive Area> can be disabled by disabling the
configuration parameter “DioCriticalSectionProtection”.
Table 4-1
DIO Driver protected Resources List
API Name
Exclusive Area Type
Protected
Resources
HW Registers:
Dio_WritePort
DIO_REGISTER_PROTECTION
PMSR
HW Registers:
Dio_WriteChannel
DIO_REGISTER_PROTECTION
PMSR
HW Registers:
Dio_FlipChannel
DIO_REGISTER_PROTECTION
PMSR
PNOT
HW Registers:
Dio_WriteChannel
DIO_REGISTER_PROTECTION
PMSR
Group
HW Registers:
Dio_MaskedWriteP
DIO_REGISTER_PROTECTION
PMSR
ort
Note: The worst case critical section value is 0.412 microseconds measured for
Dio_WriteChannel API.
20
Forethoughts Chapter 4
4.4.
Deviation List
Table 4-2 Driver Deviation List of DIO module
Sl. No.
Description AUTOSAR
Bugzilla
1.
The API Dio_MaskedWritePort which is available in R3.2.2 is also
-
added to R4.0.3 release.
2.
In case of Multiple configuration sets used, configuring different short
-
name for the containers 'DioPort', 'DioChannel' and
'DioChannelGroup' across the configuration set shall result in
generation error.
3.
In case of Multiple configuration sets used, configuring different
-
number of ‘DioPort’ or 'DioChannel' or 'DioChannelGroup' containers
across the configuration set shall result in generation error.
4.5.
User mode and supervisor mode
The below table specifies the APIs which can run in user mode, supervisor
mode or both modes.
Table 4-3 User mode and Supervisor mode details
Sl.No.
List of API’S
User Mode
Supervisor Mode
Known limitation
in User mode
1.
Dio_Init
x
x
-
2.
Dio_ReadPort
x
x
-
3.
Dio_WritePort
x
x
-
4.
Dio_ReadChannel
x
x
-
5.
Dio_WriteChannel
x
x
-
6.
Dio_FlipChannel
x
x
-
7.
Dio_ReadChannelGroup
x
x
-
8.
Dio_WriteChannelGroup
x
x
-
9.
Dio_MaskedWritePort
x
x
-
10.
Dio_GetVersionInfo
x
x
-
Note: Implementation of Critical Section is not dependent on MCAL. Hence Critical Section is not
considered to the entries for User mode in the above table.
21
Chapter 4 Forethoughts
22

Architecture Details
Chapter 5
Chapter 5
Architecture Details
The overview of the AUTOSAR DIO software architecture is given in the
following figure. The DIO Driver Component access the hardware features
directly. The upper layers call the functionalities provided by DIO Driver
Component:
I/O Hardware Abstraction Software
I/O Hardware Abstraction
DIO_WritePort
DIO_ReadPort
DIO_WriteChannelGroup
DIO_ReadChannelGroup
DIO_WriteChannel
DIO_ReadChannel
Dio_MaskedWritePort
DIO_FlipChannel
DIO_Init
DIO Driver
On- Chip Registers
On- Chip Hardware
Figure 5-1
DIO Driver Architecture
23
Chapter 5 Architecture Details
DIO Driver Component:
The following figure shows the various functionalities as offered by the DIO
Driver.
Port
Read
Channel
Channel Group
Port
Write
Channel
Channel Group
Write and Read
Channel
Figure 5-2
DIO Driver Services
The DIO Driver Component is divided into the following sub modules based
on the functionality required:
• Port Read and Port Write
• Channel Read and Channel Write
• ChannelGroup Read and ChannelGroup Write
DIO Read Port
The levels of all channels of a DIO Port will be read. A bit value '0' indicates
the individual channels of the Port to physical STD_LOW, a bit value '1'
indicates the individual channels of the port to physical STD_HIGH. The level
of all channels of Port are read simultaneously.
DIO Read Channel
The level of a single DIO Channel will be read as either STD_LOW or
STD_HIGH.
DIO Read ChannelGroup
The levels of all channels of a DIO Channel Group will be read. A bit value '0'
indicates the corresponding pin to physical STD_LOW, a bit value '1' indicates
the corresponding channel to physical STD_HIGH.
24
Architecture Details
Chapter 5
DIO Write Port
The levels of all channels of a Port will be set simultaneously without affecting
the functionality of the input channels. A bit value '0' sets the corresponding
channel to physical STD_LOW, a bit value '1' sets the corresponding channel
to physical STD_HIGH.
DIO Write Channel
The level of a single DIO Channel is set STD_HIGH or STD_LOW.
DIO Write ChannelGroup
All adjoining subset of DIO channels of a port are set simultaneously. A bit
value '0' sets the corresponding channel to physical STD_LOW, a bit value '1'
sets the corresponding channel to physical STD_HIGH.
DIO Initialization
All the global variables of the DIO modules will be initialized.
DIO Flip Channel
The level of a single DIO channel will be set with compliment of current level
that is, if current value is STD_HIGH then STD_LOW will be set and vice
versa and then the level of a single DIO Channel will be read.
DIO GetVersionInfo
The Dio_GetVersionInfo function shall return the version information of this
module.The version information includes module ID, Vendor ID and Vendor
specific version numbers.
DIO MaskedWrite Port
The Dio_MaskedWritePort function shall set the specified value for the
channels in the specified port if the corresponding bit in Mask is ‘1’.
25
Chapter 5 Architecture Details
26
Register Details
Chapter 6
Chapter 6 Register Details
This section describes the register details of DIO Driver Component.
Table 6-1 Register Details
API Name
Registers
Config Parameter
Register Access
Macro/Variable
R/W/RW
Dio_Init
-
-
-
-
Dio_ReadPort
PPRn
-
R
LddPortLevel
JPPRn
-
R
LddPortLevel
Dio_WritePort
PSRn
-
R/W
Level
JPSRn
-
R/W
Level
PMSRn
-
R
LulPortModeLevel
JPMSRn
-
R
LulPortModeLevel
Dio_ReadChannel
PPRn
DioChannelBitPosition
R
LddPortLevel
JPPRn
DioChannelBitPosition
R
LddPortLevel
Dio_WriteChannel
PSRn
DioChannelBitPosition
R/W
LunPSRContent.ulLongWord
JPSRn
DioChannelBitPosition
R/W
LunPSRContent.ulLongWord
PMSRn
-
R
LulPortModeLevel
JPMSRn
-
R
LulPortModeLevel
Dio_FlipChannel
PNOTn
DioChannelBitPosition
W
-
JPNOTn
DioChannelBitPosition
W
-
PPRn
DioChannelBitPosition
R
LddPortLevel
JPPRn
DioChannelBitPosition
R
LddPortLevel
PMSRn
-
R
LulPortModeLevel
JPMSRn
-
R
LulPortModeLevel
Dio_ReadChannelGroup
PPRn
DioPortMask and
R
LddPortLevel
DioPortOffset
JPPRn
DioPortMask and
R
LddPortLevel
DioPortOffset
Dio_WriteChannelGroup
PSRn
DioPortMask and
R/W
LunPSRContent.ulLongWord
DioPortOffset
JPSRn
DioPortMask and
R/W
LunPSRContent.ulLongWord
DioPortOffset
PMSRn
-
R
LulPortModeLevel
JPMSRn
-
R
LulPortModeLevel
Dio_GetVersionInfo
-
-
-
-
Dio_MaskedWritePort
PSRn
-
R/W
-
JPSRn
-
R/W
-
PMSRn
-
R
LulPortModeLevel
JPMSRn
-
R
LulPortModeLevel
27
Chapter 6 Register Details
28
Interaction between the User and DIO Driver Component
Chapter 7
Chapter 7
Interaction between the User and DIO
Driver Component
The details of the services supported by the DIO Driver Component to the
upper layers users and the mapping of the channels to the hardware units is
provided in the following sections:
7.1. Services Provided By DIO Driver Component To The
User
The DIO Driver Component provides the following functionalities to the upper
layers or users:
• To initialize the DIO module.
• To read the physical level value from DIO Port.
• To write specified value into given DIO Port.
• To read physical level value from DIO Channel.
• To write a specified value into the given DIO Channel.
• To read physical level value from DIO ChannelGroup.
• To write specified value into DIO ChannelGroup.
• To read the DIO Driver Component version information.
• To write specified value with a specified mask into given DIO Port.
• To flip the level of a channel and return the level of the channel after flip.
29
Chapter 7 Interaction between the User and DIO Driver Component
30
DIO Driver Component Header and Source File Description
Chapter 8
Chapter 8
DIO Driver Component Header and
Source File Description
This section explains the DIO Driver Component’s source and header files.
These files have to be included in the project application while integrating with
other modules.
The C header file generated by DIO Driver Component Code Generation
Tool:
• Dio_Cfg.h
• Dio_Cbk.h
The C source file generated by DIO Driver Component Code Generation
Tool:
• Dio_PBcfg.c
The DIO Driver Component C header files:
•
Dio.h
•
Dio_Debug.h
•
Dio_PBTypes.h
•
Dio_Ram.h
•
Dio_Version.h
•
Dio_RegWrite.h
The DIO Driver Component C source files:
• Dio.c
• Dio_Ram.c
• Dio_Version.c
The Stub C header files:
• Compiler.h
• Compiler_Cfg.h
• MemMap.h
• Platform_Types.h
• Det.h
• Rte.h
• SchM_Dio.h
31
Chapter 8 DIO Driver Component Header and Source File Description
Dem.h
Std_Types.h
The description of the DIO Driver Component files is provided in the table below:
Table 8-1 Description of the DIO Driver Component Files
File
Details
Dio_Cfg.h
This file is generated by the DIO Driver Component Code Generation Tool for DIO
Driver Component pre-compile time parameters. This file contains macro definitions
for the configuration elements. The macros and the parameters generated will vary
with respect to the configuration in the input ARXML file.
Dio_Cbk.h
This file contains declarations of notification functions to be used by the application.
The notification function name can be configured.
Dio_PBcfg.c
This file contains post-build configuration data. The structures related to DIO
Initialization are provided in this file. Data structures will vary with respect to
parameters configured.
Dio.h
This file provides extern declarations for all the DIO Driver Component APIs. This file
provides service Ids of APIs, DET Error codes and Global Data Types for DIO Driver
component. This header file shall be included in other modules to use the features of
DIO Driver Component.
Dio_Debug.h
This file provides Provision of global variables for debugging purpose.
Dio_RegWrite.h
This file is to have macro definitions for the registers write and verification.
Dio_PBTypes.h
This file contains the macros used internally by the DIO Driver Component code and
the structure declarations related to hardware unit registers, HARDWARE unit,
Channel configuration, Group configuration, Group RAM data and HARDWARE unit
RAM data.
Dio_Ram.h
This file contains the extern declarations for the global variables that are defined in
Dio_Ram.c file and the version information of the file.
Dio_Version.h
This file contains the macros of AUTOSAR version numbers of all modules that are
interfaced to DIO.
Dio.c
This file contains the implementation of all DIO Driver Component APIs.
Dio_Version.c
This file contains the code for checking version of all modules that are interfaced to
DIO.
Dio_Ram.c
This file contains the global variables used by DIO Driver Component.
Compiler.h
Provides compiler specific (non-ANSI) keywords. All mappings of keywords, which
are not standardized, and/or compiler specific are placed and organized in this
compiler specific header.
Compiler_Cfg.h
This file contains the memory and pointer classes.
MemMap.h
This file allows to map variables, constants and code of modules to individual
memory sections. Memory mapping can be modified as per ECU specific needs.
Platform_Types.h
This file provides provision for defining platform and compiler dependent types.
Det.h
This file is a stub for DET Component.
Rte.h
This file is a stub for Rte Component.
Std_Types.h
This file is a stub file which contains the standard type definitions.
SchM_Dio.h
This file provide a stub for SchM component.
Dem.h
This file provides a stub for Dem component.
32
Generation Tool Guide
Chapter 9
Chapter 9 Generation Tool Guide
For more information on the Dio Driver Component Generation Tool, please
refer “R20UT3709EJ0100-AUTOSAR.pdf” document.
33
Chapter 9 Generation Tool Guide
34
Application Programming Interface Chapter 10
Chapter 10 Application Programming Interface
This section explains the Data types and APIs provided by the DIO Driver
Component to the Upper layers.
10.1. Imported Types
This section explains the Data types imported by the DIO Driver Component
and lists its dependency on other modules.
10.1.1. Standard Types
In this section all types included from the Std_Types.h are listed:
Std_VersionInfoType
10.1.2. Other Module Types
DIO Driver Component module does not depend on other modules. Hence no
types from other modules are imported.
10.2. Type Defintions
This section explains the type definitions of DIO Driver Component according
to AUTOSAR Specification.
Refer “AUTOSAR_SWS_DIODriver.pdf” for more type definitions
10.2.1. Dio_ChannelType
Name:
Dio_ChannelType
Type:
uint8
Range:
0 to 255
Description:
Type definition for Dio_ChannelType used by Dio_ReadChannel and Dio_WriteChannel
35
Chapter 10 Application Programming Interface
10.2.2. Dio_PortType
Name:
Dio_PortType
Type:
uint8
Range:
0 to 255
Description:
Type definition for Dio_PortType used by Dio_ReadPort and Dio_WritePort.
10.2.3. Dio_PortLevelType
Name:
Dio_PortLevelType
Type:
uint16
Range:
0 to 65535
Description:
Type definition for Dio_PortLevelType used by Dio_ReadPort, Dio_WritePort,
Dio_ReadChannelGroup and Dio_WriteChannelGroup.
10.2.4. Dio_ConfigType
Name:
Dio_ConfigType
Type:
Structure
Range:
Implementation specific.
This structure contains all post-build configurable parameters of the DIO driver.
Description:
A pointer to this structure is passed to the DIO driver initialization function for
configuration.
36
Application Programming Interface Chapter 10
10.3. Function Definitions
Table10-1
DIO Driver Component’s API list.
Sl no
API’s of R4.0.3
1.
Dio_Init
2.
Dio_ReadPort
3.
Dio_WritePort
4.
Dio_ReadChannel
5.
Dio_WriteChannel
6.
Dio_FlipChannel
7.
Dio_ReadChannelGroup
8.
Dio_WriteChannelGroup
9.
Dio_MaskedWritePort
10.
Dio_GetVersionInfo
37
Chapter 10 Application Programming Interface
38
Development and Production Errors
Chapter 11
Chapter 11 Development and Production Errors
In this section the development errors that are reported by the DIO Driver
Component are tabulated. The development errors will be reported only when
the pre compiler option DIO_DEV_ERROR_DETECT is enabled in the
configuration. The DIO Driver Component does not support any production
errors.
11.1. DIO Driver Component Development Errors
The following contains the DET errors that are reported by DIO Driver
Component. These errors are reported to Development Error Tracer Module
when the DIO Driver Component APIs are invoked with wrong input
parameters or without initialization of the driver.
Table 11-1
DET Errors of DIO Driver Component (1/2)
Sl. No.
1
Error Code
DIO_E_PARAM_INVALID_CHANNEL_ID
Related API(s)
Dio_ReadChannel , Dio_WriteChannel and Dio_FlipChannel
Source of Error
When the above mentioned APIs are invoked with invalid Channel ID
Sl. No.
2
Error Code
DIO_E_PARAM_CONFIG
Related API(s)
Dio_Init
Source of Error
When the above mentioned API is invoked with NULL parameter.
Sl. No.
3
Error Code
DIO_E_PARAM_INVALID_PORT_ID
Related API(s)
Dio_ReadPort, Dio_WritePort , Dio_WriteChannel, Dio_FlipChannel,
Dio_WriteChannelGroup and Dio_MaskedWritePort
Source of Error
When the above mentioned APIs are invoked with invalid Port ID
Sl. No.
4
Error Code
DIO_E_PARAM_INVALID_GROUP
Related API(s)
Dio_ReadChannelGroup and Dio_WriteChannelGroup
Source of Error
When the above mentioned APIs are invoked with invalid ChannelGroup ID
Sl. No.
5
Error Code
DIO_E_INVALID_DATABASE
Related API(s)
Dio_Init
Source of Error
When the above mentioned API is called without a database or invalid database
39
Chapter 11 Development and Production Errors
Sl. No.
6
Error Code
DIO_E_UNINIT
Related API(s)
Dio_ReadChannel, Dio_WriteChannel, Dio_ReadPort, Dio_WritePort,
Dio_ReadChannelGroup , Dio_WriteChannelGroup and
Dio_FlipChannel, Dio_MaskedWritePort
Source of Error
When the above mentioned APIs are invoked without module initialization.
Sl. No.
7
Error Code
DIO_E_PARAM_POINTER
Related API(s)
Dio_ReadChannelGroup , Dio_WriteChannelGroup and Dio_FlipChannel
Source of Error
When the above mentioned APIs are invoked with invalid pointer
11.2. Dio Driver Component Production Errors
None.
40














Memory Organization
Chapter 12
Chapter 12 Memory Organization
Following picture depicts a typical memory organization, which must be met
for proper functioning of DIO Driver Component software.
ROM Section
DIO Driver Component
RAM Section
Library / Object Files
Global RAM of unspecific size required for DIO
Driver functioning.
Y1
Segment Name:
NO_INIT_RAM_UNSPECIFIED
DIO Driver code related to AP Is are
Global 1- bit RAM to be initialized by start- up
placed in this memory.
X1
code.
Segment Name :
Y2
Segment Name:
DIO_PUBLIC _CODE_ROM
RAM_1BIT:
Global 16- bit RAM to be initialized by start- up
code.
Y3
Segment Name:
NO_INIT_RAM_16BIT:
Tool Generated File
The const section (other than D IO Configuration
structure) in the file Dio_PBcfg.c is placed in this
memory
X2
Segment Name:
DIO_CFG_DATA_UNSPECIFIED
Figure 12-1
DIO Driver Component Memory Organization
41
Chapter 12 Memory Organization
DIO_PUBLIC_CODE_ROM (X1): API(s) of DIO Driver Component, which
can be located in code memory.
DIO_CFG_DATA_UNSPECIFIED (X2): This section consists of DIO
Driver Component constant configuration structures. This can be located in
code memory.
RAM Section (Y1, and Y2):
NO_INIT_RAM_UNSPECIFIED (Y1): This section consists of the global RAM
pointer variables that are used internally by DIO Driver Component. This can
be located in data memory.
RAM_1BIT (Y2): This section consists of the global RAM variables of 1-bit
size that are used internally by DIO Driver Component. This can be located in
data memory.
NO_INIT_RAM_16BIT (Y3): This section consists of the global RAM
variables of 16-bit size that are used internally by DIO Driver Component and
other software components. The specific sections of respective software
components will be merged into this RAM section accordingly. This can be
located in data memory.
Notes:
• X1, Y1, and Y2 pertain to only DIO Driver Component and do not include
memory occupied by Dio_PBcfg.c files generated by DIO Driver
Component Generation Tool.
• User must ensure that none of the memory areas overlap with each other.
Even ‘debug’ information should not overlap.
42
P1M Specific Information Chapter 13
Chapter 13 P1M Specific Information
P1M supports following devices:
•
R7F701304
•
R7F701305
•
R7F701310
•
R7F701311
•
R7F701312
•
R7F701313
•
R7F701314
•
R7F701315
•
R7F701318
•
R7F701319
•
R7F701320
•
R7F701321
•
R7F701322
•
R7F701323
13.1. Interaction between the User and DIO Driver
Component
13.1.1. Translation Header File
The P1x_translation.h file supports following devices:
•
R7F701304
•
R7F701305
•
R7F701310
•
R7F701311
•
R7F701312
•
R7F701313
•
R7F701314
•
R7F701315
•
R7F701318
•
R7F701319
•
R7F701320
•
R7F701321
•
R7F701322
•
R7F701323
13.1.2. Parameter Definition File
Parameter definition files support information for P1M
43

Chapter 13 P1M Specific Information
Table13-1 PDF information for P1M
PDF Files
Devices Supported
R403_DIO_P1M_04_05_12_13_20_21. 701304, 701305, 701312, 701313, 701320,
arxml
701321
R403_DIO_P1M_10_11_14_15_18_19
701310, 701311, 701314, 701315, 701318,
_22_23.arxml
701319, 701322, 701323
13.2. Sample Application
13.2.1 Sample Application Structure
The Sample Application is provided as reference to the user to understand the
method in which the DIO APIs can be invoked from the application.
Generic
AUTOSAR TYPES
COMPILER
rh850
TYPES
Devices
STUB
P1x
Det
DIO
Sample
Dem
Application
Figure 13-1 Overview of DIO Driver Sample Application
44
P1M Specific Information Chapter 13
The Sample Application of the P1M is available in the path
X1X/P1x/modules/dio/sample_application
The Sample Application consists of the following folder structure
X1X/P1x/modules/dio/definition/<Subvariant>/R403_DIO_P1M_04_05_12_13_
20_21.arxml
X1X/P1x/modules/dio/definition/<Subvariant>/R403_DIO_P1M_10_11_14_15_
18_19_22_23.arxml
X1X/P1x/modules/dio/sample_application/<Subvariant> /<AUTOSAR_version>
/src/Dio_PBcfg.c
/inc/Dio_Cfg.h
/inc/Dio_Cbk.h
/config/App_DIO_P1M_701304_Sample.arxml
/config/App_DIO_P1M_701305_Sample.arxml
/config/App_DIO_P1M_701310_Sample.arxml
/config/App_DIO_P1M_701311_Sample.arxml
/config/App_DIO_P1M_701312_Sample.arxml
/config/App_DIO_P1M_701313_Sample.arxml
/config/App_DIO_P1M_701314_Sample.arxml
/config/App_DIO_P1M_701315_Sample.arxml
/config/App_DIO_P1M_701318_Sample.arxml
/config/App_DIO_P1M_701319_Sample.arxml
/config/App_DIO_P1M_701320_Sample.arxml
/config/App_DIO_P1M_701321_Sample.arxml
/config/App_DIO_P1M_701322_Sample.arxml
/config/App_DIO_P1M_701323_Sample.arxml
In the Sample Application all the DIO APIs are invoked in the following
sequence:
• The API Dio_GetVersionInfo is invoked to get the version of the DIO
Driver module with a variable of Std_VersionInfoType, after the call of
this API the passed parameter will get updated with the DIO Driver
version details.
• The API Dio_Init is invoked with a valid database address for the
proper initialization of the DIO Driver, all the DIO Driver control
registers and RAM variables will get initialized after this API is called.
45
Chapter 13 P1M Specific Information
• The API Dio_WriteChannel is invoked to set the required level of a
particular channel. It sets the output level of the channel if that particular
channel is configured in output mode. If channel is configured for input
mode, Dio_WriteChannel has no effect.
•
The API Dio_ReadChannel reads the actual physical level of the
required channel. The level read for the input channel is actual
physical level of that channel if input buffer for that channel is
enabled. The level read for the output channel is actual physical level
of that channel if bidirectional control for that channel is enabled.
• The API Dio_WritePort is invoked to simultaneously set the required
levels to all channels of a port. It sets the output level of the channels
which are configured in output mode, for the channels which are
configured in input mode, Dio_WritePort has no effect.
•
The API Dio_ReadPort reads the actual physical level of all the port
pins of a required port. The level read for the input port pin is actual
physical level of that port pin if input buffer for that port pin is enabled.
The level read for the output port pin is actual physical level of that port
pin if bidirectional control for that port pin is enabled.
•
The API Dio_WriteChannelGroup is invoked to simultaneously set the
required levels to group of channels of a port. It sets the output level of
the channels which are configured in output mode, for the channels
which are configured in input mode, Dio_WriteChannelGroup has no
effect.
•
The API Dio_ReadChannelGroup reads the actual physical level of
channel group of a required port. The level read for the input channel
group is actual physical level of that channel group if input buffer for that
channel group is enabled. The level read for the output channel group is
actual physical level of that channel group if bidirectional control for that
channel group is enabled.
• The API Dio_MaskedWritePort provides service to set value of given port
with required mask.The Dio_MaskedWritePort function shall set the
specified value for the channel in specified port if the corresponding bit in
mask is ‘1’.
• The API Dio_FlipChannel reads the level of the channel and invert it,
then write the inverted level to the channel if the channel is configured as
output channel and the function shall have no influence on the physical
output if the channel is configured as input channel.
13.2.2 Building Sample Application
13.2.2.1
Configuration Example
This section contains the typical configuration which is used for measuring
RAM/ROM consumption, stack depth and throughput details.
Configuration Details:
Name of the configuration file:
App_DIO_<SubVariant>_<Device_Name>_Sample.arxml
13.2.2.2
Debugging the Sample Application
Remark GNU Make utility version 3.81 or above must be installed and available in the
path as defined by the environment user variable “GNUMAKE” to complete
the build process using the delivered sample files.
46
P1M Specific Information Chapter 13
• Open a Command window and change the current working directory
to “make” directory present as mentioned in below path:
“X1X\P1x\common_family\make\<Compiler>”
Now execute batch file SampleApp.bat with following parameters:
SampleApp.bat dio 4.0.3 <Device_name>
<Device_name> can be 701304, 701305, 701310, 701311, 701312,
701313, 701314, 701315, 701318, 701319,
701320, 701321, 701322 and 701323.
After this, the tool output files will be generated with the configuration as
mentioned in App_DIO_P1M_<Device_name>_Sample.arxml file
available in the path:
• “X1X\P1x\modules\dio\sample_application\<SubVariant>\<AUTOSAR_versi
on> \config”
• After this, all the object files, map file and the executable file Sample.out
will be available in the output folder
(“X1X\P1x\modules\dio\sample_application\<SubVariant>\obj\<Compiler>”
in this case).
• The executable can be loaded into the debugger and the sample
application can be executed.
Remark Executable files with ‘*.out’ extension can be downloaded into the target
hardware with the help of Green Hills debugger.
 If any configuration changes (only post-build) are made to the
ECU Configuration Description files
 “X1X\P1x\modules\dio\sample_application\< SubVariant >
\<AUTOSAR_version>config \ App_DIO_P1M_701310_Sample.arxml”
The database alone can be generated by using the following commands.
make –f App_DIO_P1M_Sample.mak generate_dio_config
make –f App_DIO_P1M_Sample.mak App_Dio_P1M_Sample.s37
After this, a flashable Motorola S-Record file App_Dio_P1M_Sample.s37 is
available in the output folder.
13.3. Memory and Throughput
13.3.1.
ROM/RAM Usage
The details of memory usage for the typical configuration provided in Section
13.2.2.1 Configuration Example are provided in this section.
47
Chapter 13 P1M Specific Information
Table13-2 ROM/RAM Details with DET
Sl.
ROM/RAM
Segment Name
Size in bytes
No.
for 144 pin
device
R7F701310
1.
ROM
DIO_PUBLIC_CODE_ROM
1402
DIO_PRIVATE_CODE_ROM
0
CONST_ROM_UNSPECIFIED
0
DIO_CFG_DATA_UNSPECIFIED
56
2.
RAM
NO_INIT_RAM_16BIT
2
NO_INIT_RAM_UNSPECIFIED
8
DIO_CFG_RAM_UNSPECIFIED
-
0
-
The details of memory usage for the typical configuration, with DET enabled
and all other configurations as provided in 13.2.2.1 Configurati- on Example are
provided in this section.
Table13-3 ROM/RAM Details without DET
Sl.
ROM/RAM
Segment Name
Size in bytes
No.
for 144 pin
device
R7F701310
1.
ROM
DIO_PUBLIC_CODE_ROM
708
DIO_PRIVATE_CODE_ROM
0
CONST_ROM_UNSPECIFIED
0
DIO_CFG_DATA_UNSPECIFIED
56
2.
RAM
NO_INIT_RAM_16BIT
2
NO_INIT_RAM_UNSPECIFIED
8
DIO_CFG_RAM_UNSPECIFIED
-
0
-
-
13.3.2.
Stack Depth
The worst-case stack depth for DIO Driver Component for the typical
Configuration provided in Section 13.2.2.1 is 24 bytes.
13.3.3.
Throughput Details
The throughput details of the APIs for the configuration mentioned in the
Section13.2.2.1 Configuration Example.
The clock frequency used to measure the throughput is 80 MHz for all APIs.
48
P1M Specific Information Chapter 13
Table13-4 Throughput Details of the APIs
Sl. No.
API Name
Throughput in
Remarks
microseconds
for R7F701310
1.
Dio_Init
0.3
-
2.
Dio_WriteChannel
1.37
-
3.
Dio_ReadChannel
0.487
-
4.
Dio_WritePort
0.912
-
5.
Dio_ReadPort
0.325
-
6.
Dio_WriteChannelGroup
1.87
-
7.
Dio_ReadChannelGroup
0.5
-
8.
Dio_MaskedWritePort
0.9
-
9.
Dio_FlipChannel
1.37
-
10.
Dio_GetVersionInfo
0.137
-
49
Chapter 13 P1M Specific Information
50
Release Details Chapter 14
Chapter 14 Release Details
DIO Driver Software
Version: 1.0.11
51
Chapter 14 Release Details
52
Revision History
Sl.No.
Description
Version
Date
1.
Initial Version
1.0.0
30-Sep-2013
2
Updated for 100 pins and 144 pins device for P1x E4.02
1.0.1
27-Jan-2014
3
Following change is made:
1.0.2
13-Mar-2014
In page no 40, Header is changed.
In section 13.3.2.1, configuration file mentioned changed.
In page no 54, Header is added.
4.
Following change is made:
1.0.3
25-Aug-2014
In section 13.4 RAM/ROM details and throughput details
are updated.
Section 13.1.2 is added.
Section 13.2 is updated for compile and Linker and
Assembler options.
5.
Following changes are made:
1.0.4
04-Sep-2014
Table 11-1 is updated.
Repeated DIO_CFG_DBTOC_UNSPECIFIED is removed
from RAM section from table 13-5 and from table 13-6.
DIO_E_PARAM_POINTER is removed from DET Error
codes.
6.
Following changes are made:
1.0.5
18-Nov-2014
User manual is updated as per Template.
Dio_MaskedWritePort information is provided in section 5
and section 7.
Throughput Details are updated in section 13.4.3
7.
Following changes are made:
1.0.6
27-May-2015
Chapter 2 reference documents section is updated.
Chapter 3 section 3.1.1 is updated for new devices.
Chapter 4 section 4.1 General is updated and a note is
added regarding interrupt vector (.c) file
Chapter 4 section 4.4 Deviation list is updated.
Chapter 13 Section for compiler, linker, and assembler
details is removed.
Chapter 13
13.1.1 Translation header files section is updated as per
new devices.
13.1.2 PDF section is updated as per new devices.
13.2.1 Sample application structure is updated for new
devices
13.2.2 Building sample application section is updated
13.3 Memory and throughput details are updated for 144
pin devices.
8.
Following changes are made,
1.0.7
28-Mar-2016
1. In section 13.2, the description details for the APIs are updated.
2. In Chapter 14,DIO Driver Software version is updated
3. In Chapter 4, section General is updated.
4. Chapter 2 is updated for related documents.
5. Chapter 3 is updated for RUCG details.
6. Chapter 9 is updated for R-Number version of TUM.
7. Chapter 12 ‘Memory Organization’ has been updated to remove
the sections DIO_CFG_DBTOC_UNSPECIFIED and RAM_1BIT and
added NOINIT_RAM_16BIT.
8. Chapter 13.3 ‘Memory and Throughput’ is updated.
9. Section 4.3 Data Consistency is updated for exclusive areas.
53
Sl.No.
Description
Version
Date
9
Following changes are made,
1.0.8
04-Aug-2016
1. Updated section 4.4 Deviation list
2. Updated section 13.3. Memory and throughput details.
3. Added a ‘Note’ below the table 'Supervisor mode and User mode
details'.
4. Updated section 13.2, removed reference to .one and .html files
5. Updated Chapter 6 ‘Register Details’.
6. Updated section 4.3 Data consistency by adding Table 4-1 Dio
driver protected resources list.
7. R Number updated.
8. Updated Chapter 14 ‘Release Details’.
9.Updated Chapter 12 ‘Memory Organization’.
10.Chapter 8 is updated for Dio_RegWrite.h in C Header files and
Std_Types.h added to Stub files.
11.Clock frequency mentioned in section 13.3.3 is changed to
80Mhz.
10
Following changes are made,
1.0.9
21-Oct-2016
1. Updated Chapter 6 ‘Register Details’.
2. Updated section 13.3 Memory and Throughput.
3. Updated section 4.2 Preconditions.
4. Updated section 3.1.1 Folder Structure.
54
55
AUTOSAR MCAL R4.0.3 User's Manual
DIO Driver Component Ver.1.0.9
Embedded User’s Manual
Publication Date: Rev.1.00, October 21, 2016
Published by: Renesas Electronics Corporation


SALES OFFICES
http://www.renesas.com
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
2880 Scott Boulevard Santa Clara, CA 95050-2554, U.S.A.
Tel: +1-408-588-6000, Fax: +1-408-588-6130
Renesas Electronics Canada Limited
1101 Nicholson Road, Newmarket, Ontario L3Y 9C3, Canada
Tel: +1-905-898-5441, Fax: +1-905-898-3220
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-585-100, Fax: +44-1628-585-900
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-65030, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
7th Floor, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100083, P.R.China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 204, 205, AZIA Center, No.1233 Lujiazui Ring Rd., Pudong District, Shanghai 200120, China
Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898
Renesas Electronics Hong Kong Limited
Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2886-9318, Fax: +852 2886-9022/9044
Renesas Electronics Taiwan Co., Ltd.
7F, No. 363 Fu Shing North Road Taipei, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
1 harbourFront Avenue, #06-10, keppel Bay Tower, Singapore 098632
Tel: +65-6213-0200, Fax: +65-6278-8001
Renesas Electronics Malaysia Sdn.Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics Korea Co., Ltd.
11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5141
© 2016 Renesas Electronics Corporation. All rights reserved.
Colophon 1.0


AUTOSAR MCAL R4.0.3
User’s Manual
R20UT3708EJ0100
Document Outline
- Chapter 1 Introduction
- Chapter 2 Reference Documents
- Chapter 3 Integration and Build Process
- Chapter 4 Forethoughts
- Chapter 5 Architecture Details
- Chapter 6 Register Details
- Chapter 7 Interaction between the User and DIO Driver Component
- Chapter 8 DIO Driver Component Header and Source File Description
- Chapter 9 Generation Tool Guide
- Chapter 10 Application Programming Interface
- Chapter 11 Development and Production Errors
- Chapter 12 Memory Organization
- Chapter 13 P1M Specific Information
- Chapter 14 Release Details